Nikon Xt V 160 User Manual

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Compact, versatile and easy-to-use electronics QA system

The XT V 130C is a highly flexible and costeffective electronics and semiconductor inspection system. The system features a 130 kV/10 watt Nikon Metrology manufactured source, a globally recognized open tube design with integrated generator, and a high-resolution imaging chain.

Superb image magnification enables users to zoom in on any specific item of interest

Features

Proprietary 20-130 kV micro-focus source with 2 μm feature recognition
Measurement area of 406x406 mm
True 75° manipulator tilting angle allows oblique viewing for easy inspection of internal features
A hinged door providing easy access to the inspection area
Serviceable components are easily accessible

Applications

Electronic and electrical components
- Broken wedge bonds, lifted ball bonds, wire sweep, die attach, dry joints, bridging/shorts, voiding, BGA, etc.
Populated and unpopulated PCBs
- View surface mount defects i.e. misaligned devices, solder joint porosity and bridging
- Detailed inspection of vias, through-hole plating and multi-layer alignment
- Wafer-level chip scale packages (WLCSP)
- BGA and CSP inspection
- Non-lead solder inspection
Micro-electro-mechanical systems (MEMS, MOEMS)
Cables, harnesses, plastics and many more

Benefits

On-line operation with intuitive joystick navigation
Low-cost maintenance with open-tube technology
Safe system requiring no special precautions or batches
Small footprint and low-weight for easy installation
CT option possible

Products & Solutions

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Corporate Video

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Research

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